The US Army has awarded an SBIR research project to Alphacore for the novel application of its emerging commercial imaging technologies for the heterogeneous integration of infrared photodetector arrays and CMOS-based multiplexing circuitry. Alphacore’s new methodology and novel techniques are advancing integration of infrared focal plane arrays (IRFPAs). Proven through-silicon via (TSV) technology will realize 3D hybridization of infrared (IR) sensor arrays and readout integrated circuits (ROICs). These methodologies will improve the manufacturability of IRFPAs and also enable new possibilities in compact FPA design, capable of supporting future advancements in infrared sensor technology.
The innovative technology also maximizes performance, reliability, and manufacturability of IR FPAs. These benefits will not only provide the Army with a distinct advantage in electronic warfare arenas but they can also be utilized by FPA manufacturers in order to increase their production process, and the performance of their devices, while reducing cost.
