Thermal management in power supplies is another important factor to consider.
According to a Mil/Embedded Systems article “Reduced size, weight, and power (SWaP) and increased standardization requirements for applications from unmanned aircraft to ground vehicles to portable communications systems are driving military power supply designs. Meanwhile, innovations such as gallium nitride (GaN) and silicon carbide (SiC) are improving efficiencies.”
Mission priorities drive requirements for military applications, and that is no different for power supplies. For example, to enable persistent surveillance, sensor payloads need more efficient power and the push toward more portable electronics for war¬fighters requires the same efficiency but in smaller and smaller footprints – pressuring power supply designers to innovate more than ever before.
Thermal management in power supplies is another important factor to consider.
According to a Mil/Embedded Systems article “Reduced size, weight, and power (SWaP) and increased standardization requirements for applications from unmanned aircraft to ground vehicles to portable communications systems are driving military power supply designs. Meanwhile, innovations such as gallium nitride (GaN) and silicon carbide (SiC) are improving efficiencies.”
Mission priorities drive requirements for military applications, and that is no different for power supplies. For example, to enable persistent surveillance, sensor payloads need more efficient power and the push toward more portable electronics for war¬fighters requires the same efficiency but in smaller and smaller footprints – pressuring power supply designers to innovate more than ever before.
DoD Awards SBIR Phase I Contract to develop Distributed Power Management solution for realizing a high efficiency radiation/hardened Solar Array Interface (SAI)